Guoqing Li

李国庆  Guoqing Li

正高级工程师(教授级工程师)

浪潮集团 · 山东云海国创云计算装备产业创新中心

Hardware Accelerator Machine Learning AI for EDA

01 About Me

Dr. Guoqing Li is a 正高级工程师(教授级工程师) (Professor-level Senior Engineer) at Inspur Group — Shandong Yunhai Guochuang Cloud Computing Equipment Industry Innovation Center. He received his Ph.D. from Southeast University (东南大学) in 2022.

Dr. Li’s research lies at the intersection of machine learning, hardware accelerator design, and AI for EDA. His work focuses on developing efficient computing architectures and AI-driven methodologies to accelerate chip design workflows, optimize hardware-software co-design, and build high-performance computing platforms for cloud-scale AI workloads.

He is particularly interested in bridging the gap between emerging AI algorithms and efficient hardware implementations, with applications spanning from neural network processors to AI-assisted EDA tools for next-generation semiconductor design.

02 Research Interests

Hardware Accelerator

Design and optimization of domain-specific accelerators (FPGA / ASIC) for AI workloads, including neural network processors, dataflow architectures, and memory hierarchy optimization.

FPGA ASIC Dataflow Architecture Memory Optimization

Machine Learning

Efficient deployment and acceleration of machine learning models, including model compression, quantization, pruning, and hardware-aware neural architecture search.

Model Compression Quantization Pruning NAS

AI for EDA

Applying machine learning techniques to electronic design automation, including AI-driven logic synthesis, placement and routing optimization, design space exploration, and predictive modeling for chip design workflows.

Logic Synthesis ML for EDA Design Space Exploration Predictive Modeling

03 Publications

04 Experience & Education

2022 – Present

正高级工程师(教授级工程师)

浪潮集团 · 山东云海国创云计算装备产业创新中心

Hardware accelerator design, AI for EDA, and machine learning research & development.

2018 – 2022

Ph.D. in 电子科学与技术 / Computer Engineering

东南大学 (Southeast University)

05 Contact

Feel free to reach out if you are interested in collaboration or have any questions.